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Dielectric Solutions’
GlasFab®
Process is a breakthrough that provides a superior performing product in a number of important respects. Stronger –
GlasFab®
Process produces a fabric that is
significantly stronger than traditional glass
fabric. Also, composite laminates produced
with our fabric exhibit superior properties.
Thinner & Flatter -
TwistFree™
yarns yield a thinner, flatter glass fabric for the
same weight and construction.
More Consistent –
TwistFree™
fabric construction yields a more consistent, more uniform fabric, where weave knuckles are minimized, and glass fibers are more uniformly distributed.
Improved Electrical & Thermal Properties –
DirectFinish™ sizing
technology provides a better interface between the
glass fiber reinforcement and the resin matrix,
yielding improved electrical and thermal properties.
Improved Coated Fabrics –
GlasFab®
TwistFree™
fabric is less porous than traditional glass fabric
produced with twisted yarns. The result is a
higher quality, resin-rich coated fabric, where
pinholes and exposed fibers are minimized.
This can also lead to significant material cost
savings for coating operations.
Improved Dimensional Stability – The high strength properties of
our glass fabric combined with the more
uniform distribution of our
TwistFree™
glass fiber yarns, provides for improved dimensional stability in laminate for circuit board applications.
Improved Drilling & Machining –
TwistFree™
fabric construction yields a more consistent, more uniform fabric, where weave knuckles are minimized and glass fibers are more uniformly distributed, resulting in improved drilling and machining characteristics.
Improved CAF Resistance -
DirectFinish™ sizing application provides a better interface between the glass fiber reinforcement and the resin matrix, thereby helping to reduce the incidence of CAF-related failures in circuit board applications.
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